Cherry Ooi & Nitza Basoco & Pam Fulton | theCUBE + NYSE Wired: GSA Series

In this episode of the GSA Series on Women in Leadership, theCUBE’s John Furrier engages with industry leaders Cherry Ooi (ASE), Nitza Basoco (Teradyne), and Pam Fulton (Intel) to discuss the latest trends in semiconductor packaging, testing, and market adoption. The panel highlights the driving forces of AI, high-performance computing, and edge demands, which are transforming advanced packaging methods like 2.5D and 3D integration, and chiplet designs. They emphasize the importance of collaboration between OSATs and foundries for system-level solutions rather than isolated approaches. The conversation extends to the necessity of early test vehicles in yield learning and supply chain preparedness to meet future demands. Closing the discussion, the guests offer career insights for aspiring professionals in the semiconductor industry, focusing on the critical skills needed for the evolving landscape.

Key Topics Covered:

• Impact of AI and high-performance computing on semiconductor packaging.
• The transition from point solutions to system-level collaborations among OSATs and foundries.
• Importance of early test vehicles for yield learning and strategy enhancements.
• Emergence of co-packaged optics (CPO) as a significant innovation.
• Substrate innovation's role in power delivery and performance.
• Challenges in supply chain readiness and capacity planning for future demands.
• Career pathways and essential skills in the semiconductor industry, including AI fluency and cross-disciplinary expertise.
• New stakeholder dynamics in semiconductor partnerships and supply chains.